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PR AMD Unveils Workload-Tailored Innovations and Products at The Accelerated Data Center Premiere

Press Release - englischsprachige Pressemitteilung

Pressemitteilung

Hinweis: Dieser Inhalt ist eine Pressemitteilung des Herstellers. Planet 3DNow! prüft weder die Richtigkeit der Angaben noch die Art der Formulierung. Pressemitteilungen können subjektiv sein und geben nicht notwendigerweise die Meinung der auf Planet 3DNow! schreibenden Autoren wieder.
— AMD launches AMD Instinct™ MI200 series accelerators, previews 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache, and provides new details on expanded set of next-generation EPYC™ processors powered by “Zen 4” and “Zen 4c” CPU cores—

— Meta chooses EPYC™ CPUs for its data center —

SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) held the virtual Accelerated Data Center Premiere, launching the new AMD Instinct™ MI200 series accelerators, the world’s fastest accelerator for high performance computing (HPC) and artificial intelligence (AI) workloadsi, and provided a preview of the innovative 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache. AMD also revealed new information about its next generation “Zen 4” processor core and announced the new “Zen 4c” processor core, both of which will power future AMD server processors and are designed to extend the company’s leadership products for the data center.

“We are in a high-performance computing megacycle that is driving demand for more compute to power the services and devices that impact every aspect of our daily lives,” said Dr. Lisa Su, president and CEO, AMD. “We are building significant momentum in the data center with our leadership product portfolio, including Meta’s adoption of AMD EPYC to power their infrastructure and the buildout of Frontier, the first U.S. exascale supercomputer which will be powered by EPYC and AMD Instinct processors. In addition, today we announced a breadth of new products that build on that momentum in next-generation EPYC processors with new innovations in design, leadership, 3D packaging technology, and 5 nm high-performance manufacturing to further extend our leadership for cloud, enterprise and HPC customers.”

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