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New Intel Architectures and Technologies Target Expanded Market Opportunities

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SANTA CLARA, Calif., Dec. 12, 2018 – At Intel “Architecture Day,” top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles.

Intel demonstrated a range of 10nm-based systems in development for PCs, data centers and networking, and previewed other technologies targeted at an expanded range of workloads.

More: New Intel Architectures and Technologies Target Expanded Market Opportunities

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Together these technologies lay the foundation for a more diverse era of computing in an expanded addressable market opportunity of more than $300 billion by 2022.[/style]1The company also shared its technical strategy focused on six engineering segments where significant investments and innovation are being pursued to drive leaps forward in technology and user experience. They include: advanced manufacturing processes and packaging; new architectures to speed-up specialized tasks like AI and graphics; super-fast memory; interconnects; embedded security features; and common software to unify and simplify programming for developers across Intel’s compute roadmap.
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Intel Architecture Day Highlights:
  • Industry-First 3D Stacking of Logic Chips: Intel demonstrated a new 3D packaging technology, called “Foveros,” which for the first time brings the benefits of 3D stacking to enable logic-on-logic integration.

    Foveros paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies. Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors for the first time.

    The technology provides tremendous flexibility as designers seek to “mix and match” technology IP blocks with various memory and I/O elements in new device form factors. It will allow products to be broken up into smaller “chiplets,” where I/O, SRAM and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top.

    Intel expects to launch a range of products using Foveros beginning in the second half of 2019. The first Foveros product will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die. It will enable the combination of world-class performance and power efficiency in a small form factor.

    Foveros is the next leap forward following Intel’s breakthrough Embedded Multi-die Interconnect Bridge (EMIB) 2D packaging technology, introduced in 2018.
  • New Sunny Cove CPU Architecture: Intel introduced Sunny Cove, Intel’s next-generation CPU microarchitecture designed to increase performance per clock and power efficiency for general purpose computing tasks, and includes new features to accelerate special purpose computing tasks like AI and cryptography. Sunny Cove will be the basis for Intel’s next-generation server (Intel® Xeon®) and client (Intel® Core™) processors later next year. Sunny Cove features include:
    1Intel calculated 2022 total addressable market opportunity derived from industry analyst reports and internal estimates.

    2Average idle read latency is the mean time for read data to return to a requesting processor. This is an average; some latencies will be longer. Tests document performance of components on a particular test, in specific systems. Differences in hardware, software or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks.

    Forward-Looking Statements

    Statements in this news summary that refer to future plans and expectations, including with respect to Intel’s future products and the expected availability and benefits of such products, are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. Such statements are based on the company’s current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations are set forth in Intel’s earnings release dated October 25, 2018, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date. Additional information regarding these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Forms 10-K and 10-Q. Copies of Intel’s Form 10-K, 10-Q and 8-K reports may be obtained by visiting our Investor Relations website at www.intc.com or the SEC’s website at www.sec.gov.
 
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