PR TSMC Offers the Industry’s Most Successful FinFET Technology to Academia

[Pressemitteilung]

HSINCHU, Taiwan, R.O.C., Feb. 3, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today announced the launch of its “TSMC University FinFET Program”, aimed at developing future IC design talent for the industry and empowering academic innovation around the world. The program will provide broad educational access for university students, faculty, and academic researchers to the process design kit (PDK) of the industry’s most successful fin field-effect transistor (FinFET) technology at 16nm, bringing the IC design learning experience to the advanced FinFET level. The program will also provide access for leading IC researchers in universities to both 16nm (N16) and 7nm (N7) silicon through multi-project wafer (MPW) services to accelerate impactful research innovations towards real-world applications.

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