packaging

  1. pipin

    Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS-S and Integrated Fan-Out Certified Design Flows

    MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS‑S) and...
Oben Unten