1. pipin

    PR Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions

    HBM3 IP Solution Delivers Maximum Memory Bandwidth of 921 GB/s for High-Performance Computing, AI, and Graphics SoCs MOUNTAIN VIEW, Calif., Oct. 7, 2021 /PRNewswire/ — Highlights of this Announcement: The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and...
  2. pipin

    Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS-S and Integrated Fan-Out Certified Design Flows

    MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS‑S) and...
Oben Unten