• In dieser Sektion des Forums werden Pressemitteilungen der Hersteller 1:1 veröffentlicht. Planet 3DNow! übernimmt weder für die Richtigkeit der Angaben noch für die Art der Formulierung jedwede Verantwortung. Oft sind Pressemitteilungen mit typischen Marketing-Floskeln wie "einer der bedeutendsten Herstellern von XY" versetzt. Diese Aussagen sind subjektiv und geben nicht notwendigerweise die Meinung der auf Planet 3DNow! schreibenden Autoren wieder.

PR AMD Introduces World’s Largest FPGA-Based Adaptive SoC for Emulation and Prototyping

Press Release - englischsprachige Pressemitteilung

Pressemitteilung

Hinweis: Dieser Inhalt ist eine Pressemitteilung des Herstellers. Planet 3DNow! prüft weder die Richtigkeit der Angaben noch die Art der Formulierung. Pressemitteilungen können subjektiv sein und geben nicht notwendigerweise die Meinung der auf Planet 3DNow! schreibenden Autoren wieder.
AMD Versal Premium VP1902 adaptive SoC offers 2X the capacity of previous-generation FPGAs, providing chipmakers with the tools to bring new ASIC and SoC designs to market faster ─​

Collaboration with EDA leaders Cadence, Siemens and Synopsys helps ensure chip designers have access to scalable ecosystem of fully-featured solutions ꟷ​

SANTA CLARA, Calif., June 27, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announced the AMD Versal™ Premium VP1902 adaptive system-on-chip (SoC), the world’s largest<sup>1</sup> adaptive SoC. The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Offering 2X<sup>2</sup> the capacity over the prior generation, designers can confidently innovate and validate application-specific integrated circuits (ASICs) and SoC designs to help bring next generation technologies to market faster.

AI workloads are driving increased complexity in chipmaking, requiring next-generation solutions to develop the chips of tomorrow. FPGA-based emulation and prototyping provides the highest level of performance, allowing faster silicon verification and enabling developers to shift left in the design cycle and begin software development well before silicon tape-out. AMD, through Xilinx, brings over 17 years of leadership and six generations of the industry’s highest capacity emulation devices, which have nearly doubled in capacity each generation<sup>3</sup>.

“Delivering foundational compute technology to enable our customers is a top priority. In emulation and prototyping, that means delivering the highest capacity and performance possible,” said Kirk Saban, corporate vice president, Product, Software, & Solutions Marketing, Adaptive and Embedded Computing Group, AMD. “Chip designers can confidently emulate and prototype next-generation products using our VP1902 adaptive SoC, accelerating tomorrow’s innovations in AI, autonomous vehicles, Industry 5.0 and other emerging technologies.”​

Confidently Emulate and Prototype Next-Generation Designs

As complexity grows in ASIC and SoC designs, especially with the rapid advancement of AI and ML-based chips, extensive verification of both silicon and software before tape-out is a must.

The VP1902 delivers industry leading capacity and connectivity, delivering 18.5M logic cells for 2X<sup>2</sup> higher programmable logic density and 2X<sup>4</sup> aggregate I/O bandwidth compared to the previous generation Virtex™ UltraScale+™ VU19P FPGA.

(…)

» Pressemitteilung lesen
 
Zurück
Oben Unten