PR Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

[Pressemitteilung]

Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture.[span id="more-12177"][/span]

The OSDZU3 leverages Integrated Circuit manufacturing technology to integrate:

<li style="text-align: left;">AMD-Xilinx Zynq UltraScale+ MPSoC ZU3</li> <li style="text-align: left;">A Complete and Flexible Power System</li> <li style="text-align: left;">LPDDR4</li> <li style="text-align: left;">EEPROM</li> <li style="text-align: left;">QSPI</li> <li style="text-align: left;">MEMS Oscillators</li> <li style="text-align: left;">Over one hundred passives</li> <li style="text-align: left;">All into a single 20.5mm x 40mm BGA</li>

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