As our source of Wall Street we had predicted, actually AMD is preparing a new x86 architecture , suitable for all market segments (Low-Mid-High), but more about that a little later.
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It should first be said that AMD plans to boost the business of the CPU and APU custom, so the next x86 architecture will be highly moldable, starting from a very strong base, like what happens with the ARMv8 architecture. Future production processes will be very expensive, so you absolutely must maximize the cost / performance / watt:
- Mini-Core from IPC (Jaguar Puma-style) that can scale in frequency up to 4 GHz (depending on the production process, from 28nm to 14nm);
- Custom Construction: L2 Cache for the APU Consumer, Cache L2 and L3 for the APU / CPU business;
- SIMD modular (each customer can add SIMD necessary; SIMD different for the consumer market and the business market);
- HSA can be easily implemented;
- IMC DDR3 (the current one) and / or IMC DDR4 (new);
- Use of HBM memories on-package (optional).
AMD plans to compete with this x86 architecture under construction, in all possible sectors (apart from that of the smartphone). Since the market is too fragmented in the Server requests (Google, Baidu, Amazon, etc., they all want a Custom SoC), this seems the only way to have an economic return: to create a new x86 architecture, today, it is very expensive. Intel is not for nothing, at least until 2017-18, will not propose nothing really new compared to Sandy Bridge.